Mr. Hackler is President & CEO of American Semiconductor, having co-founded the company in 2001, and is a co-inventor of Semiconductor-on-Polymer Chip Scale Package technology. At American Semiconductor Doug maintains overall corporate and operational responsibilities. He is a U.S. manufacturing industry advocate and leader who is known for his commitment to industry development of advanced electronics. He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at American Semiconductor, M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has twenty patents and patents pending for advanced CMOS and packaging technology and has published numerous technical papers. Doug holds degrees in engineering from the University of Idaho and Boise State University, and in business from Texas Tech University.