Dr. Woong Sun Lee is Senior Vice President and in charge of Advanced Package & Module Technology and SK hynix Indiana Office at SK hynix, the second largest semiconductor memory chip company.

Dr. Lee succeeded in developing products using TSV(Through silicon via) and WLP(Wafer level package), the original technologies of Microelectronics Packaging, and mass-producing them for the first time in the world 2013. Typically, High Bandwidth Memory(HBM) products  have been successfully full automated mass-produced since 2020, and SK hynix has contributed to solidifying its No. 1 position in the HBM market.

In addition, as a microelectronics packaging expert, he is active as a technical committee of various organizations such as IEEE EPS(Electronics Packaging Society), ITRS(International Technical Roadmap for Semiconductors), and IMAPS(International Microelectronics Assembly & Packaging Society) since 2007.

Dr. Lee joined SK Group in 2005 and served in charge of PKG product development and PKG technology development from 2005 to 2018, Wafer level package manufacturing technology from 2019 to 2023, and is currently in charge of AP&M technology and SK hynix Indiana Office.

He received Ph.D in Materials Science and  Engineering from Korea Advanced Institute of Science and Technology(KAIST).